資料來源:
三民書局
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Modeling, analysis, design, and tests for electronics packaging beyond Moore / Hengyun Zhang [and three others].
- 作者： Zhang, Hengyun, author.
- 其他題名：
- Woodhead Publishing series in electronic and optical materials
- 出版： Duxford, United Kingdom : Woodhead Publishing, an imprint of Elsevier 2020.
- 叢書名： Woodhead Publishing Series in Electronic and Optical Materials.
- 主題： Electronic apparatus and appliances--Packaging.
- ISBN： 9780081025321 、 9780081025338 (electronic bk.)
- URL：
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- 一般註：110年度臺灣學術電子書暨資料庫聯盟採購
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讀者標籤：
- 系統號： 000291913 | 機讀編目格式
館藏資訊
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.
資料來源：
三民書局
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